Focusing on Adhesives & Thermal Management | Changfu Chemical Invites You to Shenzhen BOND & CIME 2026

The BOND 2026 International Adhesives and Sealants Exhibition & CIME 2026 International Thermal Conductive Materials Exhibition will be held concurrently from June 10 to 12 at the Shenzhen World Exhibition & Convention Center (Baoan New Hall). As an important player in the field of high-performance silicon-based new materials, Changfu Chemical will provide one-stop silicon-based functional material solutions for adhesive sealing, thermal conductivity and electrical conductivity, electronic packaging, coating resins, and high-end composite materials. Booth: 14H73.

During the exhibition, Changfu Chemical will focus on showcasing three core product matrices in the "Raw Materials and Chemical Products・Functional Additives and Solvents" themed exhibition area: 

1.    Specialty Silane Coupling Agents 

Primarily aimed at enhancing adhesion and optimizing filler dispersion, with customized functional groups suitable for various scenarios:

• High Adhesion Type: Silane with long-chain amino, cyclic aza and carboxyl structures, which can form chemical bonds with resins such as epoxy and polyurethane, featuring high reliability in bonding and sealing difficult-to-adhere substrates including metals, glass and composite materials.
• For high-filled systems: Bridging inorganic fillers with polymer matrices to enhance compatibility and dispersion and reduce system viscosity; additionally, polyethylene glycol-modified silanes are used to improve filler wetting, hydrophobic modification, and dispersion stability, addressing processing challenges in thermal/electrical conductive adhesives.

        2.    Reactive Polysiloxane

With active groups that can participate in resin curing, the molecular-level modification of material properties includes:

• Toughening and crack resistance: Introducing organic silicon flexible segments to alleviate issues of brittle fracture due to thermal shock in electronic packaging and coatings.
• Enhanced cross-linking: Multifunctional groups construct a three-dimensional network, improving adhesion and resistance to moisture and heat.
• Interface optimization: Providing a hydrophobic and weather-resistant texture, while activating the filler interface and reducing thermal resistance.
• Complete functional groups: Including cycloaliphatic epoxy, acrylate, amino, vinyl, etc., suitable for various.

        3.    Solvent-based Colloidal Silica

Sol 15nm silica particles are pre-dispersed products, eliminating the need for powder depolymerization, and can be directly added to formulations:

• Adhesives/Sealants: Thixotropic thickening, temperature resistance reinforcement.
• Thermal management materials: Constructing thermal conductivity networks, adjusting rheological properties.
• Rich solvent systems: Methanol, ethanol, isopropanol, PM, PMA, EA, etc., including UV curing-specific models.

As a technology-driven company focused on the research and production of high-performance silicon-based new materials, Changfu Chemical's participation in this exhibition aims to accurately grasp the technological development trends in the domestic and international adhesive and thermal conductivity fields and deeply understand the potential needs of customers. We adhere to providing professional and customized products and technical services, offering innovative ideas and reliable support for the pursuit of higher-performance formulation design.

Appointment and Consultation:

We welcome industry colleagues to make appointments in advance and visit our booth for one-on-one technical exchanges and business discussions. Starting from today, you can contact us to obtain product information or schedule an on-site meeting!

Phone: (+86) 181-6277-0058

Email: sales@cfsilanes.com

Key words: BOND 2026; CIME 2026; Adhesives and Sealants; Thermal Conductive Materials; Changfu Chemical; Silane.