Changfu Chemical Shines at BOND & CIME 2026 in Shenzhen: Full Range of Silicon-Based New Materials Draw Wide Attention & Foster New Industry Partnerships

Held from June 10 to 12, BOND 2026 Shenzhen International Adhesives Exhibition & CIME International Thermal Conductive and Heat Dissipation Materials Exhibition successfully wrapped up at Shenzhen Bao'an International Convention & Exhibition Center. Changfu Chemical showcased its complete lineup of silicon-based new materials. Our booth attracted constant crowds, with vibrant business negotiations and technical exchanges, delivering fruitful exhibition results.

During the event, we welcomed numerous merchants, technicians and procurement specialists from adhesives, thermal conductive gels, electronic packaging, composite materials and other sectors. Combining customers' actual working conditions, our team addressed common industrial challenges including adhesion failure, filler agglomeration and poor colloid stability. We shared practical application solutions and offered one-on-one guidance on raw material selection and formula optimization. Multiple clients confirmed sample cooperation intentions on site.

Our three core product lines stood out as major highlights, perfectly meeting market demands:

1. Special Silane Coupling Agents

Modified silanes with long-chain amino, carboxyl and heterocyclic groups enhance adhesion for hard-to-bond substrates such as metals, glass fibers and special composite materials. Silanes dedicated to high-filling systems improve the dispersion of inorganic fillers, reduce the viscosity of thermal/conductive adhesive systems and eliminate powder agglomeration, making them highly sought-after by manufacturers of thermal conductive adhesives and sealants.

Changfu^® MPE32 and C1832 deliver outstanding performance in surface treatment of thermal conductive fillers as well as viscosity reduction and dispersion for high-filling systems. Many electronic thermal management enterprises requested sample tests on site.

2. Reactive Polysiloxanes

Epoxy, amino and vinyl modified polysiloxanes can participate in the cross-linking modification of epoxy, PU and silicone resins. They toughen molecular chains to prevent cracking, and improve resistance to humidity, heat and thermal shock. Meanwhile, they optimize filler interfaces and lower thermal resistance, ideal for formulations of electronic potting compounds and high-end thermal conductive coatings.

As difunctional polysiloxanes, Changfu^® BOT12 and BPO12 are highly recognized by clients in coatings and adhesives industries for effectively boosting material flexibility, water resistance and scratch resistance.

3. Colloidal Silica Series

Featuring high hardness, excellent wear resistance and thermal stability, our 15nm silica dispersion products are compatible with various solvent systems to comprehensively upgrade end-product performance. This product line drew extensive attention from traders, material suppliers and technical experts.

Exhibition ends, service continues.

Changfu Chemical will keep focusing on silicon-based new materials. With professional technical expertise and customized services, we strive to drive the development of high-performance material industry. Sample delivery and technical support are always available for win-win cooperation.

We will arrange sample delivery for all prospective clients we met at the show. New and existing customers are welcome to contact us anytime for raw material selection and formula optimization support.

📞 Tel: (+86) 181-6277-0058

📧 Email: sales@cfsilanes.com

Key words:BOND & CIME 2026; Adhesives; Thermal conductive gels; Specialty silane.