High-Purity ChangFu® TRN33: An Adhesion Promoter Adaptable to Diverse Application Scenarios

In the fields of composite materials, high-performance coatings, and precision electronic packaging, interface failure is often the key bottleneck that determines the durability and performance upper limit of products. Traditional physical adsorption or simple coupling can no longer meet the increasingly stringent demands of modern working conditions. To address this, ChangFu Chemical has launched a high-purity professional-grade adhesion promoter - ChangFu^® TRN33 (Tris[3-(triethoxysilyl)propyl]amine CAS: 18784-74-2), providing a systematic interfacial reliability solution rooted in molecular design.

Product Features:

l  High Purity Guaranty

       Ensure stable product performance — avoid issues such as paint pinholes and uneven curing of adhesives caused by impurities in the product, reduce the risk of abnormalities in the production process, and make the process smoother.

l  Excellent Water Resistance & Durability

       The dense cross-linked siloxane layer formed has hydrophobicity, which can effectively block the intrusion of moisture into the interface and resist harsh environments such as wet heat aging and salt spray corrosion.

l  Enhanced Substrate Adhesion & Corrosion Resistance 

       Significantly improve the adhesion and corrosion resistance to metal, glass and other substrates, and extend the service life of materials.

Application fields:

1.    High-performance Coatings & Adhesives

l  Industrial Anti-Corrosion Coatings: 

      Used in epoxy/polyurethane primers for ships, bridges and storage tanks, significantly improving the adhesion of coatings to metal substrates such as steel and aluminum alloys, and enhancing the ability to resist salt spray and cyclic corrosion.

l  Adhesives & Sealants:

       As a functional additive for epoxy resin adhesives and polyurethane sealants, it can improve the bonding strength and weather resistance of glass, metal, concrete and other substrates.

2.    Special Surface Treatment

l  Glass Surface Treatment:

       Used for anti-fog, anti-fingerprint or glass surface that needs subsequent coating, to build a high-adhesion active interface layer.

l  Metal Pretreatment: 

        Applicable before phosphating or passivation, or as a standalone treatment layer, providing a robust foundation for subsequent coating and bonding.

3.    Electronic Packaging & Materials

l  Chip Packaging:

       Improves bonding reliability between epoxy molding compounds and chip surfaces or lead frames, reducing delamination risks in humid and hot environments.

l  Conductive Adhesive: 

       Enhances the bonding between conductive fillers and resin matrices, strengthens adhesion to ceramic and glass substrates, and improves electrical stability and mechanical impact resistance.

Note: Specific applications should be evaluated based on actual conditions.

For further product details and application support, please contact us.

Mobile phone：（+86）181-6277-0058

Email：sales@cfsilanes.com

Key words: Tris[3-(triethoxysilyl)propyl]amine; CAS:18784-74-2; Adhesion promoter; Coating; Surface treatment.